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1. General > 115. Sudura si Lipire > 2089. Soldering Paste

Soldering Paste

Soldering Paste
Brand:
Felder
Description:
Pasta pentru lipit cupru este indicata pentru decaparea si lipirea suprafetelor de imbinare ale conductelor de cupru pentru instalatii de apa rece si calda.
Documentation:
G[gr]
660214
G[gr]: 100;
100 1/50 PCS
660215
G[gr]: 250;
250 1/50 PCS